Si-PIC光回路検査及び組立装置

Seamless Wafer Bonding

Features

• Versatile Hybrid Bonding System 
  Compatible with industry-standard die/4/6/8-inch process lines; achieve wafer bonding with high alignment accuracy (≤1μm); includes room/low-temperature plasma activation bonder, and ultra-high vacuum bonders, thermo-compression bonder for Die-to-Wafer (D2W) and Wafer-to-Wafer (W2W) applications.
  

• Comprehensive Process & Metrology Capabilities
  Supports heterogeneous integration of various materials/devices like silicon, compound semiconductors by fusion, anodic, eutectic, metal diffusion, direct, polymer, transient liquid phase (TLP), and temporary bonding/debonding processes. 

• Advanced Integration Solutions
  Enables R&D and small-batch production of Si based/compound semiconductor bonding for heterogeneous material integration, silicon photonics, and MEMS fabrication. 

• Comprehensive Inline Inspection & Characterization
  Facilitates thorough in-line inspection and characterization with exceptional efficiency, precision, and quality for pre- and post-bonding die and wafer-level samples.

Wafer Bonding Capability

Wafer Bonding Inline-Inspection

Wafer Bonding Examples  (High Bonding Yield>99%)