Si-PIC光回路検査及び組立装置

FA automatic coupling packaging system

The FA automatic coupling packaging system takes into account R&D flexibility and mass production efficiency. Different assembly systems including manual, semi-automatic and fully automatic coupling solutions can be customized, which are compatible with single-mode optical fiber (SMF), polarization-maintaining optical fiber (PMF), optical fiber array (FAU) and multi-lens coupling scenarios. These solutions can also realize automatic adhesive stamping,automatic glue dispensing, epoxy curing, etc.

Wide range of applications	Silicon photonics, TFLN, III-V etc.
High accuracy and repeatability	Coupling repeatability better than 0.3dB
High Automation	Support manual, semi-automatic and fully automatic equipments Support automatic dispensing, automatic UV curing or heat curing
Flexibility	Support fiber optic coupling, Lens coupling, FA coupling and chip to chip coupling scenarios Customized solutions according to process