Si-PIC光回路検査及び組立装置

Si-PIC光回路検査及び組立装置


Photonic chip testing system

Photonic chip testing system

The photonic chip testing system is integrated with sub-micron high-precision motion control platform, high-performance vibration isolation system, and multi-directional vision system. The system includes self-developed host computer software, integrated image recognition and artificial intelligence algorithms to realize operations such as automatic optical alignment and automatic landing of probe cards. The intermediate process does not require manual participation, greatly improving test accuracy and efficiency, and thus further reducing costs for customers.

Wide range of applications

  • Silicon photonics, TFLN, III-V chip testing etc.

High accuracy and repeatability

  • Coupling repetibility better than 0.3dB   

Automated test

  • Automatic pad alignment, automatic optical coupling, and automatic probe card cleaning

  • Manual or automatic loading and unloading of DUT

Flexibility

  • Laser bar or photonic single die

  • Chip can be loaded from Gel-pak, waffle pack and blue film wafer expanding ring etc.

  • Die sorting and defect inspection module (Optional)

  • One stop instrument selection, test algorithms and data analysis service (Optional)

  • Support OO/OE/EE/RF testing, etc.

  • Support automatic loading and unloading of multi carrier forms including Gel-pak, waffle pack and blue film wafer expanding ring etc.