Si-PIC光回路検査及び組立装置

Optoelectronic wafer test system

The optoelectronic wafer prober system comprehensively considers design requirements such as optical stability, electrical noise control and flexible testing configuration. The prober adopts a precision motion control system, a high-performance vibration isolation system, and a self-developed image software algorithm to achieve high-stability on optical performance. The embedded pA level high-precision electrical testing supports general requirements of optical die testing. With the ability of the prober system, chips out of spec can be screened at the wafer level in advance to prevent them from flowing into the back-end process, saving overall packaging and testing costs. The tester significantly improves R&D turn around cycle and mass production efficiency.

Wide range of applications	Silicon photonics, TFLN, III-V wafer testing etc.
High accuracy and repeatability	pA level ultra-low leakage and fF level ultra-low capacitance measurement Insertion loss testing repeatability better than 0.3dB
Automated test	Automatic pad alignment, automatic optical coupling, and automatic probe card cleaning
Flexibility	Compatible with 2 ~ 12 inch wafer -40℃~150℃ full scene test, no condensation at ultra-low temperature, extended temperature by custom builds DC, RF device characterization, WLR, FA and R&D debug Grating and Edge coupler coupling at different mode field diameter Compatible with single die testing