WAT-226 High Power Wafer Test System

WAT-226 High Power Wafer Test System
WAT-226 High-power wafer testing system adopts a closed vacuum chamber, which gathers moving components, heating components, cooling components, wafer chucks, probe stations, probe arms and other components used for testing in the closed vacuum chamber. This safe and stable test environment can meet the safety test requirements of extreme conditions such as high temperature, low temperature, high voltage, and high current. Moreover, it can protect devices from physical damage and pollution such as oxidation, condensation, frost, and arc breakdown.

Features

  • Optical coupling repeatability: <0.2dB
  • Probe/probe card automatic crimping, automatic light search
  • Support small beam diameter chip testing
  • Optional Sensor anti-collision design, accuracy: 2μm
  • Temperature range: ambient temperature ~95 ℃ (support wider range)
  • Compatible with various types of wafer testing
  • Optional end-to-end test solution services, including instrument selection, probe card,FA design selection, etc.

Application

The system is suitable for SiC/GaN, the third-generation semiconductor high-power wafer testing.

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