The wafer then will be transferred to the front defect inspection module tray for rapid defect detection and extraction of defective images. After the inspection is completed, the system generates a defect map and simultaneously stores the result in the production line system database for operators and engineers to analyze the situation of defect of products.
Specifications
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Defect detection system |
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Detection type |
Brightfield and darkfield |
OK |
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Imaging type |
Color / black and white |
OK |
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Detection magnification |
1.25X, 2.5X, 5X, 10X, 20X |
OK |
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Defect review |
Manual / automatic defect review |
OK |
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Measurement results upload to production line system |
Interface test results with production line systems |
OK |
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Automatic classification of defects |
Quickly and accurately classify and summarize defect areas, sizes, etc. |
OK |
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Measurement time |
Each wafer ≤30min (6inch) |
OK |
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Defect capture rate |
Typical: 99% @3 pixels size defects |
OK |
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Defect loss rate |
Typical: 1% |
OK |
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Recheck rate |
Typical: 1% |
OK |
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Anti-vibration platform |
The device needs to be equipped with a vibration isolation platform to prevent detection results from being disturbed by external vibrations |
OK |
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Silicon wafer stage |
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Compatible wafer size |
6 inch / 8 inch wafer |
OK |
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Autofocus |
The lens is equipped with a Z-axis motor for automatic focusing |
OK |
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XY and rotary stage |
XY-direction tage is required for inspection, and rotation stage is required for calibration |
OK |
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Automatic loading |
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Equipment loading |
One wafer cassette at a time, at least 25 wafers one cassette |
OK |
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Pre-calibration |
Automatic pre-calibration before loading into wafer chuck |
OK |
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Submodule |
Automatic loading can be used as a sub-module, optional according to user needs |
OK |
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